Blog

20

2023

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06

Application and Development Trend of Thermal Conductive Absorbing Materials

With the development of electronic technology, the new generation of electronic components from consumer electronics such as mobile phones and tablet computers to RFFE/antenna modules for 5G communication, MIMO, wifi6, radar and optical modules for optical communication have higher data transmission rate, higher power density and higher transmission frequency band, and require electronic equipment to have more functional modules while maintaining the existing volume or even reducing the volume, the electronic equipment will generate a large amount of waste heat when working.


With the development of electronic technology, the new generation of electronic components from consumer electronics such as mobile phones and tablet computers to RFFE/antenna modules for 5G communication, MIMO, wifi6, radar and optical modules for optical communication have higher data transmission rate, higher power density and higher transmission frequency band, and require electronic equipment to have more functional modules while maintaining the existing volume or even reducing the volume, the electronic equipment will generate a large amount of waste heat when working. This waste heat will increase the temperature of the electronic equipment, cause the stability of the equipment performance to decrease, and even cause damage to the entire system. In serious cases, it will cause accidents such as equipment fires. At the same time, if the heat dissipation is not in place, the service life of the electronic equipment will be greatly reduced. The use of high thermal conductivity functional materials can effectively evacuate excess heat and meet the needs of equipment for thermal management, which is very necessary for high power consumption systems. At the same time, with the improvement of the power density of electronic components, the electromagnetic radiation interference caused by it is also increasingly concerned. In order to improve the anti-electromagnetic interference ability of the equipment, the electronic packaging material also needs to have a certain electromagnetic wave absorption performance to protect the normal operation of the electronic components. EMI solutions can create thermal issues and vice versa. Therefore, it is difficult to solve EMI or heat dissipation problems alone, and solving these two problems at the same time has increasingly become a problem that engineers must face, especially when both need to be taken into account. Heat conductive absorbing materials came into being.
More and more applications require higher thermal conductivity, such as greater than 6 W/m K, wider wave absorption band (100M ~ 6GHz), and higher requirements for the form of heat-conducting wave absorption materials, such as heat-conducting gaskets based on the above high thermal conductivity and wide wave absorption band, which are both non-conductive and resilient, and two-component heat-conducting gels with high flow rate. The heat-conducting wave-absorbing material can be directly applied between the radiator and the metal shell, which can effectively export the heat energy, and has the performance of electromagnetic shielding and electromagnetic clutter absorption, which provides a good solution for the heat conduction and electromagnetic shielding of electronic communication products. Thermal conductive absorbing materials are mainly used in communication equipment, network equipment and TV modules and other products.
Generally speaking, the thermal conductivity, electrical conductivity and wave-absorbing properties of polymers are generally low, which limits their further application in high-performance electronic systems. Polymer composites are widely used in the field of electronic packaging due to their high performance, corrosion resistance, light weight, low production cost and other characteristics. In the current industrial production practice, in order to solve the above problems, it is a simple and direct solution to add high-performance fillers such as boron nitride, aluminum nitride, aluminum oxide, graphene, carbon fiber, carbonyl iron powder, ferrite, MXene, etc. into the polymer matrix to prepare composite materials. This processing method requires a higher filler content to improve the functionality of the material, but too high filler content will make the mechanical properties of the prepared composite material significantly reduced, affecting the practical application of the material. Therefore, the research focus of thermal conductivity and wave absorbing polymer composite materials is to select the appropriate thermal conductivity and wave absorbing fillers, while optimizing the proportion of two functional fillers, surface treatment and preparation process, to solve the problem that high molecular polymer can maintain excellent mechanical properties and anti-aging properties under high filling, and gel products can meet high functionality while taking into account the high extrusion rate of gel products, easy dispensing process, etc. will be the research and development trend of such materials in the future, and finally realize the comprehensive optimal results of thermal conductivity and wave absorption performance.

Why carbon black and coke are not adsorptive

Carbon black and coke are carbon materials, but their adsorption properties are very different. Carbon black has strong adsorption and can be used to prepare various adsorbents, while coke has almost no adsorption. Why is this?

2023-06-14

Industry remodeling makes waste tires incarnate "black gold", listed companies run into the field to dig gold.

The "ground refinery" has faded from the spotlight, and how to recycle waste tires with low consumption and harmlessness has attracted much attention. On the other hand, the state recently added waste tires, waste rubber products production of recycled oil, cracking carbon black tax rebate, but also further stimulate the enthusiasm of industrial capital entry.

2023-06-14

Application and Development Trend of Thermal Conductive Absorbing Materials

With the development of electronic technology, the new generation of electronic components from consumer electronics such as mobile phones and tablet computers to RFFE/antenna modules for 5G communication, MIMO, wifi6, radar and optical modules for optical communication have higher data transmission rate, higher power density and higher transmission frequency band, and require electronic equipment to have more functional modules while maintaining the existing volume or even reducing the volume, the electronic equipment will generate a large amount of waste heat when working.

2023-06-20

Introduction of special rubber materials-chlorosulfonated polyethylene rubber (CSM)

Chlorosulfonated polyethylene (alias: Haibolong Haibolong hypalon) is a kind of special rubber made by chlorination and chlorosulfonation of polyethylene. After chlorination and sulfonation of polyethylene, the regularity of its structure is destroyed, and it becomes soft and elastic chlorosulfonated polyethylene rubber at room temperature.

2023-06-20

Ultra-high thermal conductivity, ultra-flexible thermal conductive gasket

Ultra-high thermal conductivity, ultra-flexible thermal gasket is a thermal conductivity greater than 12 W/m · K, and both excellent flexibility series products, as shown in Table 1. This series of products is to solve the problem of heat dissipation between high heat flux and highly integrated electronic equipment heating devices and heat sinks.

2023-06-20

Qingdao Flywheel Xingbang New Material Technology Co., Ltd. is a high-tech enterprise integrating R & D, production, trade and service. It is committed to the R & D and innovation of carbon nanomaterials products.

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